IPR2023-00323 - Samsung Electronics America Inc et al. v. Imberatek LLCReport Error
Details
PATENT NUMBER
APPL. NUMBER
11878557
PETITIONER
STATUS
Settlement
FILING DATE
2022-12-09
INSTITUTION DATE
N/A
TERMINATION DATE
2023-01-24
AUTHOR JUDGE
Timeline
Petition
Motion to Terminate
Notice of Filing Date
Final Decision
Dec
2023
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
2024
Feb
Mar
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Aug
Sep
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Nov
Dec
2025
Feb
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Apr
May
Docket
| 1 | 2022-12-09 | Petitioner | Petition | Petition for Inter Partes Review of U.S. Patent No. 7,989,944 |
| 2 | 2022-12-09 | Petitioner | Power of Attorney | Samsung Electronics Co., Ltd.’s Power of Attorney |
| 3 | 2022-12-09 | Petitioner | Power of Attorney | Samsung Electronics America, Inc.’s Power of Attorney |
| 4 | 2022-12-09 | Petitioner | Power of Attorney | Samsung Austin Semiconductor, LLC’s Power of Attorney |
| 1001 | 2022-12-09 | Petitioner | U.S. Patent No. 7,989,944 to Tuominen (“the ’944 Patent”) | |
| 1002 | 2022-12-09 | Petitioner | Declaration of Dr. Bruce Smith | |
| 1003 | 2022-12-09 | Petitioner | Curriculum Vitae of Dr. Bruce Smith | |
| 1004 | 2022-12-09 | Petitioner | Prosecution History of the ’944 Patent (Application No. 11/878,557) | |
| 1005 | 2022-12-09 | Petitioner | U.S. Patent No. 7,294,529 to Tuominen (“the ’529 Patent") | |
| 1006 | 2022-12-09 | Petitioner | Prosecution History of the ’529 Patent (Application No. 10/502,336) | |
| 1007 | 2022-12-09 | Petitioner | Certified Translation of Patent Publication No. JP2001- 068624A to Imoto | |
| 1008 | 2022-12-09 | Petitioner | Japanese Patent Publication No. JP2001-068624A (“Imoto”) | |
| 1009 | 2022-12-09 | Petitioner | U.S. Patent No. 6,297,551 (“Dudderar”) | |
| 1010 | 2022-12-09 | Petitioner | U.S. Patent No. 5,306,670 (“Mowatt”) | |
| 1011 | 2022-12-09 | Petitioner | John H. Lau, Low Cost Flip Chip Technologies (2000) | |
| 1012 | 2022-12-09 | Petitioner | Underflow Process for Direct-Chip-Attachment Packaging (“Lehmann”) | |
| 1013 | 2022-12-09 | Petitioner | U.S. Patent No. 6,404,052 (“Kurita”) | |
| 1014 | 2022-12-09 | Petitioner | U.S. Pat. No. 5,608,262 (“Degani”) | |
| 1015 | 2022-12-09 | Petitioner | The IEEE Standard Dictionary of Electrical and Electronics Terms (1996) | |
| 1016 | 2022-12-09 | Petitioner | Semiconductor Chip Underfill Materials, Encyclopedia of Materials | |
| 1017 | 2022-12-09 | Petitioner | U.S. Patent No. 6,469,374 (“Imoto U.S. Patent”) | |
| 1018 | 2022-12-09 | Petitioner | Certified Translation of Japanese Patent No. P3207174 (“Hayashi”) | |
| 1019 | 2022-12-09 | Petitioner | Japanese Patent No. P3207174 (“Hayashi”) | |
| 1020 | 2022-12-09 | Petitioner | U.S. Patent No. 6,459,593 (“Kwong”) | |
| 1021 | 2022-12-09 | Petitioner | Certified Translation of Patent Publication No. JP2001- 237586A | |
| 1022 | 2022-12-09 | Petitioner | Japanese Patent Publication No. JP2001-237586A (“Asahi") | |
| 1023 | 2022-12-09 | Petitioner | Certified Translation of Japanese Patent Publication No. JP2001- 111232A | |
| 1024 | 2022-12-09 | Petitioner | Japanese Patent Publication No. JP2001-111232A (“Oya”) | |
| 1025 | 2022-12-09 | Petitioner | U.S. Patent Publication No. 2003/0090833 to Asahi | |
| 2022-12-27 | Potential Patent Owner | Mandatory Notice | Notice : Mandatory Notice | |
| 5 | 2022-12-27 | Potential Patent Owner | Mandatory Notice | Notice : Mandatory Notice |
| 6 | 2022-12-27 | Potential Patent Owner | Power of Attorney | Notice : Power of Attorney |
| 7 | 2023-01-13 | Petitioner | Motion to Terminate | Joint Motion to Dismiss Inter Partes Review Before Institution |
| 8 | 2023-01-13 | Petitioner | Other | Joint Request to Keep Separate Pursuant to 35 U.S.C. § 317(b) and 37 C.F.R. § 42.74(c) |
| 9 | 2023-01-18 | Board | Notice of Filing Date | Notice: Notice filing date accorded |
| 10 | 2023-01-24 | Board | Final Decision | Termination Decision: Pre-DI settlement |
| 11 | 2023-01-24 | Petitioner | Other | Petitioner’s Request for Refund of Post-institution Fees |
| 12 | 2023-01-31 | Board | Other | Notice: refund approved |
Grounds Asserted