IPR2018-01402 - Samsung Electronics Co Ltd v. Invensas CorpReport Error
Details
PATENT NUMBER
APPL. NUMBER
09779123
STATUS
Settlement
FILING DATE
2018-07-13
INSTITUTION DATE
N/A
TERMINATION DATE
2019-01-04
AUTHOR JUDGE
Timeline
Petition
Notice of Filing Date
Preliminary Response
Motion to Terminate
Final Decision
Jul
Aug
Sep
Oct
Nov
Dec
2019
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Docket
| 1 | 2018-07-13 | Petitioner | Petition | Petition for Inter Partes Review of U.S. Patent No. 6,849,946 |
| 2 | 2018-07-13 | Petitioner | Power of Attorney | Petitioner Samsung Electronics Co., Ltd.'s Power of Attorney |
| 3 | 2018-07-13 | Petitioner | Power of Attorney | Petitioner Samsung Electronics America, Inc.'s Power of Attorney |
| 4 | 2018-07-13 | Petitioner | Power of Attorney | Petitioner Samsung Austin Semiconductor LLC's Power of Attorney |
| 1001 | 2018-07-13 | Petitioner | U.S. Patent No. 6,849,946 ("the '946 Patent") | |
| 1002 | 2018-07-13 | Petitioner | Declaration of Dr. Michael Thomas | |
| 1003 | 2018-07-13 | Petitioner | Curriculum Vitae for Dr. Michael Thomas | |
| 1004 | 2018-07-13 | Petitioner | Prosecution File History of U.S. Patent No. 6,849,946 | |
| 1005 | 2018-07-13 | Petitioner | U.S. Patent No. 5,948,573 ("Takahashi") | |
| 1006 | 2018-07-13 | Petitioner | Japanese Patent Application 4-262535 | |
| 1007 | 2018-07-13 | Petitioner | Certified English Translation of Japanese Patent Application 4-262535 ("Tonishi") | |
| 1008 | 2018-07-13 | Petitioner | U.S. Patent No. 6,365,521 ("Shubert") | |
| 1009 | 2018-07-13 | Petitioner | T. H. Park, Framework for Characterization of Copper Interconnect in Damascene CMP Processes, 1998 | |
| 1010 | 2018-07-13 | Petitioner | Declaration of Martin Cross Regarding Translation of References from Japanese to English | |
| 1011 | 2018-07-13 | Petitioner | U.S. Patent No. 5,302,551 to Iranmanesh et al. | |
| 1012 | 2018-07-13 | Petitioner | Semiconductor Industry Association, The National Technological Roadmap for Semiconductors: Technology Needs, 1997 Edition | |
| 1013 | 2018-07-13 | Petitioner | L. Zuckerman, "IBM to Make Smaller and Faster Chips - Second Breakthrough in a Week Has Wide Uses," The New York Times, D1, Monday, September 22, 1997 | |
| 1014 | 2018-07-13 | Petitioner | U.S. Patent No. 6,109,775 to Tripathi et al. | |
| 1015 | 2018-07-13 | Petitioner | U.S. Patent No. 6,309,956 to Chiang et al. | |
| 1016 | 2018-07-13 | Petitioner | U.S. Patent No. 5,854,125 to Harvey | |
| 1017 | 2018-07-13 | Petitioner | U.S. Patent No. 6,103,626 to Kim | |
| 1018 | 2018-07-13 | Petitioner | U.S. Patent No. 6,261,883 to Koubuchi et al. | |
| 1019 | 2018-07-13 | Petitioner | U.S. Patent No. 5,874,318 to Baker | |
| 5 | 2018-08-01 | Potential Patent Owner | Power of Attorney | Patent Owner's Power of Attorney |
| 6 | 2018-08-01 | Potential Patent Owner | Mandatory Notice | Patent Owner's Mandatory Notices |
| 7 | 2018-08-29 | Board | Notice of Filing Date | Notice of Accord Filing Date |
| 8 | 2018-11-29 | Potential Patent Owner | Preliminary Response | Patent Owner's Preliminary Response |
| 9 | 2018-12-13 | Petitioner | Motion to Terminate | Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74 |
| 10 | 2018-12-13 | Petitioner | Other | Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74 |
| 11 | 2019-01-04 | Board | Final Decision | Termination Decision Document |
| 12 | 2019-01-09 | Petitioner | Other | Petitioner's Request for Refund of Fees |
| 13 | 2019-02-07 | Board | Other | Notice of Refund |
Grounds Asserted